Top-down meets bottom-up: dip-pen nanolithography and DNA-directed assembly of nanoscale electrical circuits. Journal Published:
PUBLICATION TYPE: Research Support, U.S. Gov't,
Journal: Small (Weinheim an der Bergstrasse, Germany)
VOLUME: 1
Page Numbers: 64-9
Journal Abbreviation:
ISSN: 1613-6829
DAY: 3
MONTH: Jan
YEAR: 2005
Top-down meets bottom-up: dip-pen nanolithography and DNA-directed assembly of nanoscale electrical circuits. Information
Number of References:
LANGUAGE: eng
NlmUniqueID: 101235338
Top-down meets bottom-up: dip-pen nanolithography and DNA-directed assembly of nanoscale electrical circuits. Keywords Mesh Terms:
KEYWORDS: Surface Properties
MESH TERMS: chemistry
Chemical & Substance for Abstract: Top-down meets bottom-up: dip-pen nanolithography and DNA-directed assembly of nanoscale electrical circuits. Information
Substance Name: DNA
Registry Number: 9007-49-2
Grant and Affiliation Information for Top-down meets bottom-up: dip-pen nanolithography and DNA-directed assembly of nanoscale electrical circuits.
AFFILIATION: Department of Chemistry & Institute for Nanotechnology, Northwestern University, 2145 Sheridan Road, Evanston, IL 60208-3113, USA.
Country: Germany
AGENCY: United States NHGRI
GRANT: 2F32 HG02463
ACRONYM: HG
MEDLINETA: Small
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