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Dynamics of an ultrasonic transducer used for wire bonding.

Dynamics of an ultrasonic transducer used for wire bonding. Research Abstract Details 

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  • Dynamics of an ultrasonic transducer used for wire bonding. Abstract Text:

    s w orS W Or,h w chanH W Chan,v c loV C Lo,c w yuenC W Yuen,

    The vibration displacement distributions along a transducer used in ultrasonic wire bonding were measured using a heterodyne interferometer, and many nodes and anti-nodes were found. A mechanical finite element method (FEM) was used to compute the resonant frequencies and vibration mode shapes. The displacement distributions of the dominant 2nd axial mode agreed well with the measured values. Undesirable nonaxial modes, including the higher order flexural and torsional modes, also were excited at frequencies very close to the working frequency (2nd axial mode) of the transducer. Hence, the measured displacements were the resultant of all the allowable modes being excited. However, the excitation of these nonaxial modes were small enough not to affect the formation of consistent and high quality wire bonds. Results of the present study were used to determine a suitable location for installing a piezoelectric sensor to monitor the bond quality.

    Dynamics of an ultrasonic transducer used for wire bonding. Publishing Authors By Initials

    sw orSW Or,hw chanHW Chan,vc loVC Lo,cw yuenCW Yuen,

    For similar abstracts research abstracts see: abstracts research

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    MEDLINE DATE:

    Dynamics of an ultrasonic transducer used for wire bonding. Journal Published:

    PUBLICATION TYPE: Journal Article

    Journal: IEEE transactions on ultrasonics, ferroelectrics,

    VOLUME: 45

    Page Numbers: 1453-60

    Journal Abbreviation:

    ISSN: 0885-3010

    DAY: 5

    MONTH: 02

    YEAR: 1998

    Dynamics of an ultrasonic transducer used for wire bonding. Information

    Number of References:

    LANGUAGE: eng

    NlmUniqueID: 9882735

    Dynamics of an ultrasonic transducer used for wire bonding. Keywords Mesh Terms:

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    Grant and Affiliation Information for Dynamics of an ultrasonic transducer used for wire bonding.

    AFFILIATION: Dept. of Appl. Phys., Hong Kong Polytech. Univ., Kowloon.

    Country: United States

    United States Research PublicationUnited States Research Publication

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    MEDLINETA: IEEE Trans Ultrason Ferroelect

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