This paper describes a low-profile three-dimensional silicon/parylene microelectrode array as basis for practical neural prostheses for use in the central nervous system. The circuit areas of the silicon probes, containing mixed-signal CMOS circuitry for neural stimulation/recording, can be folded over to reduce the overall height of the microassembled array above the cortical surface. The low- profile structure is implemented using multiple gold beams spaced by orthogonal silicon braces. An integrated silicon/parylene batch process is introduced to encapsulate these interconnects and achieve high yield.
A low-profile three-dimensional silicon/parylene stimulating electrode array for neural prosthesis applications. Publishing Authors By Initials
A low-profile three-dimensional silicon/parylene stimulating electrode array for neural prosthesis applications. Journal Published:
PUBLICATION TYPE: Journal Article
Journal: Conference proceedings : ... Annual International
VOLUME: 2
Page Numbers: 1293-6
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ISSN: 1557-170X
DAY: 6
MONTH: 02
YEAR: 2005
A low-profile three-dimensional silicon/parylene stimulating electrode array for neural prosthesis applications. Information
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LANGUAGE: eng
NlmUniqueID: 101243413
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AFFILIATION: Member, IEEE, Engineering Research Center for Wireless Integrated MicroSystems, University of Michigan, Ann Arbor, MI 48109-2122 USA.
Country: United States
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MEDLINETA: Conf Proc IEEE Eng Med Biol So
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